Jeong-won Jeong: search on Z-Library

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1

ADHD, suicidal ideation, depression, anxiety, self-esteem, and alcohol problem in Korean juvenile delinquency

Chung, Yong-Rae, Hong, Jeong-Won, Kim, Byung-Bae, Kim, Jun-Seong, Noh, Il Suk, Wee, Ji Hee, Kim, Nam Hee, Bae, Sung Man, Lim, Myung Ho

Journal:

Year:

2020

Language:

english

File:

PDF, 218 KB

english, 2020

2

Clinical guideline for 9-valent HPV vaccine: Korean Society of Gynecologic Oncology Guideline

Min, Kyung-Jin, Kwon, Sang-Hoon, Kim, Kidong, Kim, Sunghoon, Kim, Hyun Jung, Seong, Seok Ju, Song, Yong Jung, Lee, Keun Ho, Lee, Shin-Wha, Lee, Jeong-Won, Chang, Suk-Joon, Ju, Woong, Kim, Young-Tak, L

Journal:

Journal of Gynecologic Oncology

Year:

2019

Language:

english

File:

PDF, 564 KB

english, 2019

3

Tooth Discoloration of Immature Permanent Incisor Associated with Triple Antibiotic Therapy: A Case Report

Jong-Hyun Kim, Yuran Kim, Su-Jung Shin, Jeong-Won Park, Il-Young Jung

Journal:

Journal of Endodontics

Year:

2010

Language:

english

File:

PDF, 1.13 MB

english, 2010

4

Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Year:

2007

Language:

english

File:

PDF, 452 KB

english, 2007

5

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.76 MB

english, 2008

6

Efficient Thermal Noise Removal for Sentinel-1 TOPSAR Cross-Polarization Channel

Park, Jeong-Won, Korosov, Anton A., Babiker, Mohamed, Sandven, Stein, Won, Joong-Sun

Journal:

IEEE Transactions on Geoscience and Remote Sensing

Year:

2018

Language:

english

File:

PDF, 21.85 MB

english, 2018

7

Maximum power point tracking without current sensor for photovoltaic module integrated converter using Zigbee wireless network

Moon, Sol, Kim, Seong-Jin, Seo, Jeong-Won, Park, Joung-Hu, Park, Changkun, Chung, Chan-Su

Journal:

International Journal of Electrical Power & Energy Systems

Year:

2014

Language:

english

File:

PDF, 4.96 MB

english, 2014

8

Dissimilar friction stir welding of pure Ti and pure Al

Choi, Jeong-Won, Liu, Huihong, Fujii, Hidetoshi

Journal:

Materials Science and Engineering: A

Year:

2018

Language:

english

File:

PDF, 843 KB

english, 2018

9

South Korea's urban green energy strategies: Policy framework and local responses under the green growth

Lee, Jae-Seung, Kim, Jeong-won

Journal:

Year:

2015

Language:

english

File:

PDF, 1.21 MB

english, 2015

10

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.09 MB

english, 2008

11

Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions

Lee, Sang-Min, Yoon, Jeong-Won, Jung, Seung-Boo

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 4.55 MB

english, 2015

12

Co-treatment effect of pulsed electromagnetic field (PEMF) with human dental pulp stromal cells and FK506 on the regeneration of crush injured rat sciatic nerve

Kim, Yoon-Tae, Hei, Wei-Hong, Kim, Soochan, Seo, Young-Kwon, Kim, Soung-Min, Jahng, Jeong-Won, Lee, Jong-Ho

Journal:

International Journal of Neuroscience

Year:

2015

Language:

english

File:

PDF, 1.70 MB

english, 2015

13

Long-term Stability of Autotransplanted Premolars as a Substitute for Molars in Adults

Kim, Sunil, Shin, Su-Jung, Park, Jeong-Won, Kim, Sunjai, Hwang, Soonshin, Kim, Kyung-Ho, Chung, Chooryung J.

Journal:

Journal of Endodontics

Year:

2016

Language:

english

File:

PDF, 905 KB

english, 2016

14

Analysis of Factors Associated with Cracked Teeth

Deog-Gyu Seo, Young-Ah Yi, Su-Jung Shin, Jeong-Won Park

Journal:

Journal of Endodontics

Year:

2012

Language:

english

File:

PDF, 129 KB

english, 2012

15

Endocervical-Like versus Intestinal-Type Mucinous Borderline Ovarian Tumors: A Large Retrospective Series Focusing on the Clinicopathologic Characteristics

Song, Taejong, Choi, Chel Hun, Lee, Yoo-Young, Kim, Tae-Joong, Lee, Jeong-Won, Sung, Chang Ohk, Song, Sang Yong, Bae, Duk-Soo, Kim, Byoung-Gie

Journal:

Gynecologic and Obstetric Investigation

Year:

2013

Language:

english

File:

PDF, 307 KB

english, 2013

16

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Yoon, Jeong-Won, Back, Jong-Hoon, Jung, Seung-Boo

Journal:

Surface and Interface Analysis

Year:

2018

Language:

english

File:

PDF, 1.40 MB

english, 2018

17

Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2007

Language:

english

File:

PDF, 673 KB

english, 2007

18

Fabrication of a superhydrophobic surface with fungus-cleaning properties on brazed aluminum for industrial application in heat exchangers

Lee, Jeong-Won, Hwang, Woonbong

Journal:

Applied Surface Science

Year:

2018

Language:

english

File:

PDF, 1.14 MB

english, 2018

19

Sequential interfacial reactions of Au/In/Au transient liquid phase-bonded joints for power electronics applications

Yoon, Jeong-Won, Lee, Byung-Suk

Journal:

Thin Solid Films

Year:

2018

Language:

english

File:

PDF, 9.84 MB

english, 2018

20

Altered White Matter Structure of the Dentatorubrothalamic Pathway in Children with Autistic Spectrum Disorders

Jeong-Won Jeong, Diane C. Chugani, Michael E. Behen, Vijay N. Tiwari, Harry T. Chugani

Journal:

Year:

2012

Language:

english

File:

PDF, 956 KB

english, 2012

21

Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test

Seong-jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung, Hoo-Jeong Lee

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 774 KB

english, 2008

22

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2005

Language:

english

File:

PDF, 634 KB

english, 2005

23

Magnetization switching of CoPd alloy film on piezoelectric substrate via inverse piezoelectric effect

Jeong-Won Lee,, Sung-Chul Shin,, Sang-Koog Kim,

Journal:

IEEE Transactions on Magnetics

Year:

2003

Language:

english

File:

PDF, 313 KB

english, 2003

24

Hydrogen production by SI process, with electrodialysis stack embedded in HI decomposition section

Kang, Kyoung-Soo, Kim, Chang-Hee, Kim, Jong-Won, Cho, Won-Chul, Jeong, Seong-Uk, Park, Chu-Sik, Park, Byung-Heung, Kang, Jeong-Won, Bae, Ki-Kwang

Journal:

International Journal of Hydrogen Energy

Year:

2016

Language:

english

File:

PDF, 2.17 MB

english, 2016

25

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging

Jeong, So-Eun, Jung, Seung-Boo, Yoon, Jeong-Won

Year:

2018

Language:

english

File:

PDF, 238 KB

english, 2018

26

Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 523 KB

english, 2011

27

High galectin-1 expression correlates with poor prognosis and is involved in epithelial ovarian cancer proliferation and invasion

Ha-Jeong Kim, Hye-Kyung Jeon, Young Jae Cho, Young Ae Park, Jung-Joo Choi, In-Gu Do, Sang Young Song, Yoo-Young Lee, Chel Hun Choi, Tae-Joong Kim, Duk-Soo Bae, Jeong-Won Lee, Byoung-Gie Kim

Journal:

European Journal of Cancer

Year:

2012

Language:

english

File:

PDF, 850 KB

english, 2012

28

Theoretical method of selecting number of buckets for the design and verification of a Pelton turbine

Kim, Jeong-Won, Jo, In Chan, Park, Joo Hoon, Shin, Youhwan, Chung, Jin Taek

Journal:

Journal of Hydraulic Research

Year:

2017

Language:

english

File:

PDF, 1.62 MB

english, 2017

29

Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au

Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 1.26 MB

english, 2008

30

Solid-state interfacial reactions between Sn–3.5Ag–0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test

Hyun-Suk Chun, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2007

Language:

english

File:

PDF, 1.53 MB

english, 2007

31

Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package

Bo-In Noh,, Jeong-Won Yoon,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 1.38 MB

english, 2009

32

Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging

Jeong-Won Yoon,, Bo-In Noh,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.01 MB

english, 2010

33

Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Lee, Byung-Suk, Hyun, Soong-Keun, Yoon, Jeong-Won

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 3.75 MB

english, 2017

34

Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

Kyoung-Ho Kim,Junichi Koike,Jeong-Won Yoon,Sehoon Yoo

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.62 MB

english, 2016

35

Effect of surface finish metallization on mechanical strength of Ag sintered joint

Yoon, Jeong-Won, Back, Jong-Hoon, Jung, Seung-Boo

Journal:

Microelectronic Engineering

Year:

2018

Language:

english

File:

PDF, 3.86 MB

english, 2018

36

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging

Kim, Jungsoo, Back, Jong-Hoon, Jung, Seung-Boo, Yoon, Jeong-Won

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2019

Language:

english

File:

PDF, 4.44 MB

english, 2019

37

CHARACTERISTICS OF BISMUTH-BASED THIN FILMS DEPOSITED DIRECTLY ON POLYMER SUBSTRATES FOR EMBEDDED CAPACITOR APPLICATION

AHN, JUN-KU, KIM, HAE-WON, AHN, KYUNG-CHAN, YOON, SOON-GIL, SON, SEUNG-HYUN, JUNG, HYUNG-MI, MOON, JIN-SUCK, JIN, HYUN-JOO, LEE, SEUNG-EUN, LEE, JEONG-WON, CHUNG, YEOUL-KYO, OH, YONG-SOO

Journal:

Integrated Ferroelectrics

Year:

2007

Language:

english

File:

PDF, 3.20 MB

english, 2007

38

Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2011

Language:

english

File:

PDF, 675 KB

english, 2011

39

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Jin-Ho Joo, Young-Eui Shin, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 961 KB

english, 2007

40

Platycodon grandiflorum root attenuates vascular endothelial cell injury by oxidized low-density lipoprotein and prevents high-fat diet–induced dyslipidemia in mice by up-regulating antioxidant proteins

Mi Ja Chung, Soo-Hyun Kim, Jeong-Won Park, Young Jin Lee, Seung-Shi Ham

Journal:

Nutrition Research

Year:

2012

Language:

english

File:

PDF, 635 KB

english, 2012

41

Gliomatosis peritonei is associated with frequent recurrence, but does not affect overall survival in patients with ovarian immature teratoma

Yoon, Na Ra, Lee, Jeong-Won, Kim, Byoung-Gie, Bae, Duk-Soo, Sohn, Insuk, Sung, Chang Ohk, Song, Sang Yong

Journal:

Virchows Archiv

Year:

2012

Language:

english

File:

PDF, 279 KB

english, 2012

42

In situ vectorial magnetization study of ultrathin magnetic films using a surface magneto-optical Kerr effect measurement system

Jeong-Won Lee,, Sang-Koog Kim,, Jong-Ryul Jeong,, Jonggeol Kim,, Sung-Chul Shin,

Journal:

IEEE Transactions on Magnetics

Year:

2001

Language:

english

File:

PDF, 84 KB

english, 2001

43

Laparoendoscopic single-site radical hysterectomy for early stage cervical cancer

Park, Ju Young, Kim, Yoo Min, Lee, Yoo-Young, Kim, Tae-Joong, Lee, Jeong-Won, Kim, Byoung-Gie, Bae, Duk-Soo, Choi, Chel Hun

Journal:

Obstetrics & Gynecology Science

Year:

2017

Language:

english

File:

PDF, 619 KB

english, 2017

44

Transcriptome analysis of rice-seedling roots under soil–salt stress using RNA-Seq method

Chandran, Anil Kumar Nalini, Kim, Jeong-Won, Yoo, Yo-Han, Park, Hye Lin, Kim, Yeon-Ju, Cho, Man-Ho, Jung, Ki-Hong

Journal:

Plant Biotechnology Reports

Year:

2019

Language:

english

File:

PDF, 1.61 MB

english, 2019

45

High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging

Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 950 KB

english, 2006

46

Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2011

Language:

english

File:

PDF, 784 KB

english, 2011

47

Electrochemical characterization of Raney nickel electrodes prepared by atmospheric plasma spraying for alkaline water electrolysis

Kim, Ji-Eun, Bae, Ki-Kwang, Park, Chu-Sik, Jeong, Seong-Uk, Baik, Kyeong-Ho, Kim, Jeong-Won, Kang, Kyoung-Soo, Lee, Ki-Bong

Journal:

Journal of Industrial & Engineering Chemistry

Year:

2018

Language:

english

File:

PDF, 4.46 MB

english, 2018

48

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2009

Language:

english

File:

PDF, 478 KB

english, 2009

49

Effective punching shear and moment capacity of flat plate-column connection with shear reinforcements for lateral loading

Jin-Kyu Song, Jubum Kim, Ho-Bum Song, Jeong-Won Song

Journal:

International Journal of Concrete Structures and Materials

Year:

2012

Language:

english

File:

PDF, 2.23 MB

english, 2012

50

Comparison of bond strengths of ceramic brackets bonded to zirconia surfaces using different zirconia primers and a universal adhesive

Lee, Ji-Yeon, Ahn, Jaechan, An, Sang In, Park, Jeong-won

Journal:

Restorative Dentistry & Endodontics

Year:

2018

Language:

english

File:

PDF, 1.44 MB

english, 2018

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